Invention Grant
- Patent Title: High thermal conductivity shell molds
- Patent Title (中): 高导热性壳模
-
Application No.: US14091386Application Date: 2013-11-27
-
Publication No.: US09205484B2Publication Date: 2015-12-08
- Inventor: Qi Zhao , Stephen Francis Rutkowski , Francis Johnson , Wanming Zhang , Min Zou
- Applicant: General Electric Company
- Applicant Address: US NY Niskayuna
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Niskayuna
- Agent Paul J. DiConza
- Main IPC: B22C1/02
- IPC: B22C1/02 ; B22C3/00 ; B22C9/02
Abstract:
A shell mold is described. The shell mold includes a facecoat, a sealcoat, and a support disposed in between the facecoat and the sealcoat. The support includes a stucco in a concentration greater than about 40 volume percent of the support. The stucco includes a material that has a thermal conductivity greater than about 285 W/m-K.
Public/Granted literature
- US20150144287A1 HIGH THERMAL CONDUCTIVITY SHELL MOLDS Public/Granted day:2015-05-28
Information query
