Invention Grant
US09207024B2 Patterned heat sink layer for eliminating lateral thermal bloom 有权
图案散热层,用于消除横向热辐射

Patterned heat sink layer for eliminating lateral thermal bloom
Abstract:
The embodiments disclose at least one predetermined patterned layer configured to eliminate a physical path of lateral thermal bloom in a recording device, at least one gradient layer coupled to the patterned layer and configured to use materials with predetermined thermal conductivity for controlling a rate of dissipation and a path coupled to the gradient layer and configured to create a path of least thermal conduction resistance for directing dissipation along the path, wherein the path substantially regulates and prevents lateral thermal bloom.
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