发明授权
- 专利标题： Semiconductor device assembled using two lead frames
- 专利标题（中）： 使用两个引线框组装的半导体器件
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申请号： US14554064申请日： 2014-11-26
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公开(公告)号： US09209119B1公开(公告)日： 2015-12-08
- 发明人: Huan Wang , Hejin Liu , Weiping Sun
- 申请人： Huan Wang , Hejin Liu , Weiping Sun
- 申请人地址： US TX Austin
- 专利权人： FREESCALE SEMICONDUCTOR, INC.
- 当前专利权人： FREESCALE SEMICONDUCTOR, INC.
- 当前专利权人地址： US TX Austin
- 代理商 Charles Bergere
- 优先权： CN201410357286 20140604
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/48 ; H01L21/56 ; H01L21/78 ; H01L23/31
摘要：
A packaged semiconductor device is assembled using a first lead frame upon which a die is mounted and encapsulated and a second lead frame that provides bent leads for the device. By using two different lead frames, an array of the first lead frames can be configured with more lead frames for more devices than a comparably sized lead frame array of the prior art because the first lead frame array does not need to provide the leads for the packaged devices. Instead, the leads are provided by the second lead frame array, which can be attached to the first lead frame array after the dies have been mounted and encapsulated on the first lead frame array.
公开/授权文献
- US20150357266A1 SEMICONDUCTOR DEVICE ASSEMBLED USING TWO LEAD FRAMES 公开/授权日：2015-12-10
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