发明授权
- 专利标题： Electronic device packages having bumps and methods of manufacturing the same
- 专利标题（中）： 具有凸块的电子器件封装及其制造方法
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申请号： US14532393申请日： 2014-11-04
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公开(公告)号： US09209146B2公开(公告)日： 2015-12-08
- 发明人: Seung Jee Kim , Qwan Ho Chung , Jong Hyun Nam , Si Han Kim , Sang Yong Lee , Seong Cheol Shin
- 申请人： SK hynix Inc.
- 申请人地址： KR Gyeonggi-do
- 专利权人： SK Hynix Inc.
- 当前专利权人： SK Hynix Inc.
- 当前专利权人地址： KR Gyeonggi-do
- 代理机构： William Park & Associates Ltd.
- 优先权： KR10-2012-0063202 20120613
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L23/498 ; H01L23/538 ; H01L21/768 ; H01L23/31 ; H01L21/56
摘要：
An electronic device package includes a bump having a post disposed on a contact portion of a semiconductor chip and an enlarged portion laterally protruded from an upper portion of the post; an interconnection portion having a locking portion that substantially surrounds the enlarged portion and an upper sidewall of the post; and a dielectric layer substantially surrounding the bump and the locking portion to separate the interconnection portion from the semiconductor chip.
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