Invention Grant
- Patent Title: Connector assembly having multiple shield current paths
- Patent Title (中): 具有多个屏蔽电流路径的连接器组件
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Application No.: US14055068Application Date: 2013-10-16
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Publication No.: US09209571B2Publication Date: 2015-12-08
- Inventor: Inho Myong
- Applicant: Tyco Electronics Corporation
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R4/66
- IPC: H01R4/66 ; H01R13/648 ; H01R13/58 ; H01R13/6592 ; H01R9/03 ; H01R13/622

Abstract:
A connector assembly may include a housing that retains one or more contacts, a cable having a shield that surrounds one or more conductors that electrically connect to the one or more contacts, and a backshell that secures the housing to the cable. The backshell may include at least one wall having a backshell outer surface and a backshell inner surface, and one or more through-holes formed through the at least one wall. Each through-hole forms a current path between the backshell outer surface and the backshell inner surface.
Public/Granted literature
- US20150104976A1 CONNECTOR ASSEMBLY HAVING MULTIPLE SHIELD CURRENT PATHS Public/Granted day:2015-04-16
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