Invention Grant
- Patent Title: Pluggable module
- Patent Title (中): 可插拔模块
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Application No.: US14171233Application Date: 2014-02-03
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Publication No.: US09210817B2Publication Date: 2015-12-08
- Inventor: Eric David Briant , Troy Lyndon Blazek
- Applicant: Tyco Electronics Corporation
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K5/00

Abstract:
A pluggable module is provided for being pluggably received within a receptacle assembly. The pluggable module includes a circuit board configured to be terminated to a cable, and a housing extending a length from a plug end to a cable end. The housing includes complementary first and second shells that are mated together along a mating axis such that the first and second shells define an interior chamber of the housing. The circuit board is held within the interior chamber such that the circuit board is exposed at the plug end. The first and second shells includes respective first and second openings that extend into the respective first and second shells along respective first and second central axes that each extend non-parallel to the mating axis. The first and second openings are at least partially aligned. A spring pin extends within the first and second openings to hold the first and second shells together. A first segment of the spring pin extends within the first opening of the first shell and a second segment of the spring pin extends within the second opening of the second shell.
Public/Granted literature
- US20150223349A1 PLUGGABLE MODULE Public/Granted day:2015-08-06
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