Invention Grant
- Patent Title: Decoupling device with three-dimensional lead frame and fabricating method thereof
- Patent Title (中): 具有三维引线框架的去耦装置及其制造方法
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Application No.: US13743327Application Date: 2013-01-16
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Publication No.: US09214284B2Publication Date: 2015-12-15
- Inventor: Yi-Hsiu Pan , Yu-Ting Cheng , Li-Duan Tsai , Chi-Lun Chen
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW101133539A 20120913
- Main IPC: H01G9/012
- IPC: H01G9/012 ; H01G9/042 ; H01G9/048 ; H01G9/26 ; H01R43/00

Abstract:
A decoupling device including a lead frame and at least one capacitor unit set is provided. The lead frame includes a cathode terminal portion and at least two anode terminal portions disposed at two sides of the cathode terminal portion and opposite to each other. The anode terminal portions are electrically connected through a conductive line. One of the anode terminal portions extends along a first direction to form an extending portion, and the extending portion is bended along a second direction perpendicular to the first direction to form an anode side plate. Each capacitor unit set includes a plurality of capacitor units. The capacitor unit sets are connected in parallel on a same plane and disposed on the lead frame. Each capacitor unit has a cathode portion electrically connected to the cathode terminal portion and an anode portion electrically connected to the anode side plate along the first direction.
Public/Granted literature
- US20140071591A1 DECOUPLING DEVICE WITH THREE-DIMENSIONAL LEAD FRAME AND FABRICATING METHOD THEREOF Public/Granted day:2014-03-13
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