发明授权
- 专利标题： Substrate processing system, carrying device and coating device
- 专利标题（中）： 基板加工系统，承载装置和涂装装置
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申请号： US12547270申请日： 2009-08-25
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公开(公告)号： US09214372B2公开(公告)日： 2015-12-15
- 发明人: Tsutomu Sahoda , Futoshi Shimai , Akihiko Sato
- 申请人： Tsutomu Sahoda , Futoshi Shimai , Akihiko Sato
- 申请人地址： JP Kawasaki-Shi
- 专利权人： TOKYO OHKA KOGYO CO., LTD.
- 当前专利权人： TOKYO OHKA KOGYO CO., LTD.
- 当前专利权人地址： JP Kawasaki-Shi
- 代理机构： Knobbe, Martens, Olson & Bear, LLP
- 优先权： JP2008-219561 20080828; JP2008-219562 20080828; JP2008-219563 20080828; JP2009-143632 20090616
- 主分类号： B05C13/02
- IPC分类号： B05C13/02 ; H01L21/677 ; H01L21/67
摘要：
A substrate processing system includes a processing unit, a substrate loading unit, a substrate unloading unit, and a carrying unit. A carrying device has a constitution in which a suction portion suctioning and holding a substrate is rotatable about an arm portion provided in a base portion and the substrate is rotated in the state where the substrate is held by a holding portion. A coating device has a constitution in which a liquid material is ejected from a nozzle to both surfaces of the substrate rotating in an upright state.