发明授权
US09214418B2 Lead frame with radiator plate, method for manufacturing lead frame with radiator plate, semiconductor device, and method for manufacturing semiconductor device
有权
带散热板的引线框架，带散热板的引线框架的制造方法，半导体器件以及半导体器件的制造方法
- 专利标题： Lead frame with radiator plate, method for manufacturing lead frame with radiator plate, semiconductor device, and method for manufacturing semiconductor device
- 专利标题（中）： 带散热板的引线框架，带散热板的引线框架的制造方法，半导体器件以及半导体器件的制造方法
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申请号： US14635319申请日： 2015-03-02
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公开(公告)号： US09214418B2公开(公告)日： 2015-12-15
- 发明人: Tomohiro Kuroda
- 申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA
- 申请人地址： JP Toyota
- 专利权人： TOYOTA JIDOSHA KABUSHIKI KAISHA
- 当前专利权人： TOYOTA JIDOSHA KABUSHIKI KAISHA
- 当前专利权人地址： JP Toyota
- 代理机构： Oliff PLC
- 优先权： JP2014-054403 20140318
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/52 ; H01L21/56 ; H01L21/60
摘要：
A lead frame with a radiator plate on which a semiconductor chip 50 is to be mounted is provided with a radiator plate 30, and a lower surface side lead frame 40 including an upper surface 41 and a lower surface 42. The lower surface side lead frame 40 overlaps and fixes the radiator plate 30 with the lower surface 42 making contact with the radiator plate 30. A through hole 43 piercing the lower surface side lead frame 40 from the upper surface 41 to the lower surface 42 is formed at a position where the lower surface side lead frame 40 overlaps the radiator plate 30, and an opening area of the through hole 43 at the lower surface 42 is larger than an opening area of the through hole 43 at the upper surface 41.
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