According to example embodiments, a semiconductor package includes a first and a second semiconductor package. The first semiconductor package includes a first package substrate, first and second memory chips spaced apart from each other on the first package substrate in a first direction, third and fourth memory chips on the first and second memory chips, respectively, and first and second jumper chips on the first and second memory chips, respectively. The first and second jumper chips are spaced apart from the third and fourth memory chips, respectively, in a second direction crossing the first direction. The second semiconductor package may include a second package substrate and a logic chip on the second package substrate. The first semiconductor package may be on the second semiconductor package.