Invention Grant
- Patent Title: Non-leaded type semiconductor package and method of assembling same
- Patent Title (中): 非铅型半导体封装及其组装方法
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Application No.: US14277061Application Date: 2014-05-14
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Publication No.: US09214447B2Publication Date: 2015-12-15
- Inventor: Zhigang Bai , Zhijie Wang , Jinzhong Yao
- Applicant: Zhigang Bai , Zhijie Wang , Jinzhong Yao
- Applicant Address: US TX Austin
- Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee Address: US TX Austin
- Agent Charles Bergere
- Priority: CN201310317710 20130726
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/31 ; H01L23/495 ; H01L21/48
Abstract:
A no-lead type semiconductor package has a mold cap that forms a mold body. The corners of the mold body are reinforced with mold columns such that the corners have rounded protrusions and do not form 90° angles. The mold columns prevent the corner pads from peeling.
Public/Granted literature
- US20150028468A1 NON-LEADED TYPE SEMICONDUCTOR PACKAGE AND METHOD OF ASSEMBLING SAME Public/Granted day:2015-01-29
Information query
IPC分类:
