Invention Grant
US09214463B2 Methods of forming metal silicide regions on a semiconductor device
有权
在半导体器件上形成金属硅化物区域的方法
- Patent Title: Methods of forming metal silicide regions on a semiconductor device
- Patent Title (中): 在半导体器件上形成金属硅化物区域的方法
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Application No.: US14326623Application Date: 2014-07-09
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Publication No.: US09214463B2Publication Date: 2015-12-15
- Inventor: Hans-Juergen Thees , Peter Baars
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Amerson Law Firm, PLLC
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L27/092 ; H01L29/78 ; H01L21/768 ; H01L21/8238 ; H01L29/423 ; H01L29/49

Abstract:
An integrated circuit device includes a PMOS transistor and an NMOS transistor. The PMO transistor includes a gate electrode, at least one source/drain region, a first sidewall spacer positioned adjacent the gate electrode of the PMOS transistor, and a multi-part second sidewall spacer positioned adjacent the first sidewall spacer of the PMOS transistor, wherein the multi-part second sidewall spacer includes an upper spacer and a lower spacer. The NMOS transistor includes a gate electrode, at least one source/drain region, a first sidewall spacer positioned adjacent the gate electrode of the NMOS transistor, and a single second sidewall spacer positioned adjacent the first sidewall spacer of the NMOS transistor. A metal silicide region is positioned on each of the gate electrodes and on each of the at least one source/drain regions of the PMOS and the NMOS transistors.
Public/Granted literature
- US20140319617A1 METHODS OF FORMING METAL SILICIDE REGIONS ON A SEMICONDUCTOR DEVICE Public/Granted day:2014-10-30
Information query
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