A non-contact sensing module includes a coil printed circuit board in which a reference pattern coil may be formed at an upper surface and in which a sensing pattern coil may be formed at a lower surface and that has a mounting hole at the center, and a main printed circuit board that may be coupled to the mounting hole and that may be vertically disposed at an upper surface of the coil printed circuit board and that may be electrically connected to the reference pattern coil and the sensing pattern coil.