Invention Grant
- Patent Title: Contact bumps methods of making contact bumps
- Patent Title (中): 接触凸块的触点方法
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Application No.: US14094714Application Date: 2013-12-02
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Publication No.: US09215809B2Publication Date: 2015-12-15
- Inventor: Carsten Nieland , Frank Kriebel
- Applicant: SMARTRAC TECHNOLOGY GmbH
- Applicant Address: DE Dresden
- Assignee: SMARTRAC TECHNOLOGY GmbH
- Current Assignee: SMARTRAC TECHNOLOGY GmbH
- Current Assignee Address: DE Dresden
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H05K1/18 ; H01L21/768 ; H01L23/498 ; H05K3/30 ; H01L23/00
Abstract:
Contact bumps between a contact pad and a substrate can include recesses and protrusions that can mate with the material of the substrate. The irregular mating surfaces between the contact bumps and the contact pads can enhance the bonding strength of the contacts, for example, against shear and tension forces, especially for flexible systems such as smart cards.
Public/Granted literature
- US20140084460A1 Contact bumps methods of making contact bumps Public/Granted day:2014-03-27
Information query
IPC分类:
