Invention Grant
- Patent Title: Corner-case emulation tool for thermal power testing
- Patent Title (中): 用于火力测试的角式仿真工具
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Application No.: US14011915Application Date: 2013-08-28
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Publication No.: US09218011B2Publication Date: 2015-12-22
- Inventor: Hee-Jun Park
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: The Marbury Law Group, PLLC
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G05F1/46 ; G01R31/317

Abstract:
The various aspects provide for an IC design and methods for utilizing the IC design to emulate corner case ICs during power/thermal testing of a test system by installing a specially chosen IC on the test system. The chosen IC may be a fully functioning IC that also includes a leakage-add controller and a current leak circuit. The current leak circuit may simulate additional current leakage on the IC and may be driven by the leakage-add controller. The chosen IC may also include a programmable voltage table for adjusting the chosen IC's operational voltage. The chosen IC may emulate the thermal characteristics of various corner-case ICs while performing normal IC activities on the test system during power/thermal testing, thereby eliminating current limitations in thermal/power testing of test systems due to the difficulty of providing corner-case ICs and testing those corner-case ICs on various test systems.
Public/Granted literature
- US20150061754A1 Corner-Case Emulation Tool for Thermal Power Testing Public/Granted day:2015-03-05
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