Invention Grant
- Patent Title: Separation of chips on a substrate
- Patent Title (中): 在基板上分离芯片
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Application No.: US14013822Application Date: 2013-08-29
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Publication No.: US09219011B2Publication Date: 2015-12-22
- Inventor: Manfred Engelhardt , Gudrun Stranzl , Markus Zundel , Hubert Maier
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/30 ; H01L21/46 ; H01L21/78 ; B28D5/00
Abstract:
Various methods and apparatuses are provided relating to separation of a substrate into a plurality of parts. For example, first a partial separation is performed and then the partially separated substrate is completely separated into a plurality of parts.
Public/Granted literature
- US20150064879A1 Separation of Chips on a Substrate Public/Granted day:2015-03-05
Information query
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