Invention Grant
US09219142B2 Semiconductor device having element region and termination region surrounding element region
有权
具有元件区域和端子区域周围元件区域的半导体器件
- Patent Title: Semiconductor device having element region and termination region surrounding element region
- Patent Title (中): 具有元件区域和端子区域周围元件区域的半导体器件
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Application No.: US14491332Application Date: 2014-09-19
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Publication No.: US09219142B2Publication Date: 2015-12-22
- Inventor: Jun Saito , Sachiko Aoi , Yukihiko Watanabe , Toshimasa Yamamoto
- Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA , DENSO CORPORATION
- Applicant Address: JP Toyota JP Kariya
- Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA,DENSO CORPORATION
- Current Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA,DENSO CORPORATION
- Current Assignee Address: JP Toyota JP Kariya
- Agency: Oliff PLC
- Priority: JP2013-197410 20130924
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/423

Abstract:
A semiconductor device includes a semiconductor substrate having an element region and a termination region. The element region includes a first body region having a first conductivity type, a first drift region having a second conductivity type, and first floating regions having the first conductivity type. The termination region includes FLR regions, a second drift region and second floating regions. The FLR regions have the first conductivity type and surrounds the element region. The second drift region has the second conductivity type, makes contact with and surrounds the FLR regions. The second floating regions have the first conductivity type and is surrounded by the second drift region. The second floating regions surround the element region. At least one of the second floating regions is placed at an element region side relative to the closest one of the FLR regions to the element region.
Public/Granted literature
- US20150084124A1 SEMICONDUCTOR DEVICE Public/Granted day:2015-03-26
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