Invention Grant
US09219218B2 Method of manufacturing electric wiring layer, member for forming electric wiring layer, electric wiring layer, method of manufacturing electric wiring board, member for forming electric wiring board, electric wiring board, vibrator, electronic apparatus, and moving object
有权
制造电气布线层的方法，用于形成电布线层的部件，电布线层，电气布线板的制造方法，用于形成电气布线板的部件，电气布线板，振动器，电子设备和运动物体
- Patent Title: Method of manufacturing electric wiring layer, member for forming electric wiring layer, electric wiring layer, method of manufacturing electric wiring board, member for forming electric wiring board, electric wiring board, vibrator, electronic apparatus, and moving object
- Patent Title (中): 制造电气布线层的方法，用于形成电布线层的部件，电布线层，电气布线板的制造方法，用于形成电气布线板的部件，电气布线板，振动器，电子设备和运动物体
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Application No.: US14578991Application Date: 2014-12-22
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Publication No.: US09219218B2Publication Date: 2015-12-22
- Inventor: Hideki Ishigami , Hidefumi Nakamura , Yukihiko Shiohara , Taku Kawasaki , Fumiaki Akahane
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2013-272610 20131227
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/03 ; H01L41/047 ; H01L41/053 ; H01L41/333 ; H01L41/29 ; B22F5/12 ; B22F3/105
Abstract:
A method of manufacturing an electric wiring layer including an electric wiring includes obtaining a pressed powder molded layer by pressurizing a powder including a metal particle with an insulating layer, the metal particle being constituted by a metal particle having conductivity and a surface insulating layer which is located on a surface of the metal particle and which mainly contains a glass material; and irradiating the pressed powder molded layer with energy rays and forming the electric wiring in an irradiation region.
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