Invention Grant
- Patent Title: Method and apparatus for forming pattern
- Patent Title (中): 用于形成图案的方法和装置
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Application No.: US14500797Application Date: 2014-09-29
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Publication No.: US09223228B2Publication Date: 2015-12-29
- Inventor: Nobuyuki Ushifusa , Naohito Uemura , Shigeru Suzuki
- Applicant: Hitachi High-Technologies Corporation
- Applicant Address: JP Tokyo
- Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
- Current Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Baker Botts L.L.P.
- Priority: JP2012-120673 20120528; JP2013-030693 20130220
- Main IPC: H01L21/20
- IPC: H01L21/20 ; G03F7/20 ; B05D1/32 ; B05C3/20 ; H01L31/18 ; B41F15/40 ; B41F15/42 ; G03F7/12 ; B41M1/12 ; H01L31/0224

Abstract:
There is provided a pattern forming apparatus which transfers a paste to a predetermined position of a pattern forming object fixed to a table through a pattern forming mask having opening portions at predetermined positions using a discharge mechanism part. To realize a pattern forming which allows the stable forming of a fine pattern with high accuracy and allows the paste to be surely filled into fine through holes, a corner portion of a distal end of the discharge mechanism part in contact with the pattern forming mask is formed into a concave shape, and a surface of the distal end portion of the discharge mechanism part including the concave shaped portion is covered with a film having liquid repellency so that the rolling of the paste is accelerated in a region formed by the concave shaped portion to form a fine pattern with high accuracy.
Public/Granted literature
- US20150015867A1 METHOD AND APPARATUS FOR FORMING PATTERN Public/Granted day:2015-01-15
Information query
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