Invention Grant
- Patent Title: Conductive layered structure, electrode and supercapacitor comprising the conductive layered structure, and method for preparing the conductive layered structure
- Patent Title (中): 导电层状结构,包含导电层状结构的电极和超级电容器以及制备导电层状结构的方法
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Application No.: US13951977Application Date: 2013-07-26
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Publication No.: US09224542B2Publication Date: 2015-12-29
- Inventor: Jae-hyun Hur , No-kyoung Park , Kyu-hyun Im , Sung-woo Hwang
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2012-0081964 20120726; KR10-2012-0127735 20121112; KR10-2013-0042425 20130417
- Main IPC: H01G11/30
- IPC: H01G11/30 ; H01G11/36 ; H01G9/00 ; H01G11/24 ; H01G11/86

Abstract:
Provided are a conductive layered structure including a DNA hydrogel and a composite layer disposed on the DNA hydrogel. The composite layer may include a polymer electrolyte and a conductive material. Also provided are an electrode and a supercapacitor, each including the conductive layered structure. Further provided is a method of manufacturing the conductive layered structure. Thus, a biocompatible, implantable electrode having a large specific surface area and a high conductivity may be manufactured through simple processes.
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