Invention Grant
- Patent Title: Method of fabricating packaging substrate having a through-holed interposer
- Patent Title (中): 制造具有通孔插入件的封装基板的方法
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Application No.: US14641918Application Date: 2015-03-09
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Publication No.: US09224683B2Publication Date: 2015-12-29
- Inventor: Tzyy-Jang Tseng , Dyi-Chung Hu , Ying-Chih Chan
- Applicant: Unimicron Technology Corporation
- Applicant Address: TW Taoyuan
- Assignee: Unimicron Technology Corporation
- Current Assignee: Unimicron Technology Corporation
- Current Assignee Address: TW Taoyuan
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW101126991A 20120726
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/498 ; H01L23/48 ; H01L21/768 ; H01L21/56 ; H01L23/31 ; H05K1/11 ; H01L25/065 ; H01L23/00
Abstract:
A through-holed interposer is provided, including a board body, a conductive gel formed in the board body, and a circuit redistribution structure disposed on the board body. The conductive gel has one end protruding from a surface of the board body, and an area of the protruded end of the conductive gel that is in contact with other structures (e.g., packaging substrates or circuit structures) is increased, thereby strengthening the bonding of the conductive gel and reliability of the interposer.
Public/Granted literature
- US20150179475A1 METHOD OF FABRICATING PACKAGING SUBSTRATE HAVING A THROUGH-HOLED INTERPOSER Public/Granted day:2015-06-25
Information query
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