Invention Grant
- Patent Title: Method for non-planar chip assembly
- Patent Title (中): 非平面芯片组装方法
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Application No.: US14084482Application Date: 2013-11-19
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Publication No.: US09224716B2Publication Date: 2015-12-29
- Inventor: Long-Sheng Fan
- Applicant: Long-Sheng Fan
- Applicant Address: TW Hsinchu
- Assignee: IRIDIUM MEDICAL TECHNOLOGY CO., LTD.
- Current Assignee: IRIDIUM MEDICAL TECHNOLOGY CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/00 ; H01L27/146 ; A61N1/05
Abstract:
Methods and apparatuses for assembly of a non-planar device based on curved chips are described. Slots may be created as longitudinal openings in the chips to reduce bending stresses to increase allowable degrees of deformation of the chips. The chips may be deformed to a desired deformation within the allowable degrees of deformation via the slots. Holding constraints may be provided on at least a portion of the chips to allow the chips to remain curved according the desired deformation.
Public/Granted literature
- US20140080257A1 METHOD FOR NON-PLANAR CHIP ASSEMBLY Public/Granted day:2014-03-20
Information query
IPC分类:
