An apparatus for recovering solder from solder coated scrap pieces includes a first centrifuge comprising a centrifuge receptacle having perforation holes, rotatably mounted about a first centrifuge axis for containing and rotating a quantity of solder coated scrap pieces. A solder collection container can surround the centrifuge receptacle. A heater can surround the solder collection container for heating the solder coated scrap pieces and melting the solder thereon. A drive system can be configured for rotating the centrifuge receptacle while the first centrifuge axis is in about a horizontal position at a low speed that tumbles the scrap pieces along a longitudinal length of the centrifuge receptacle, and later rotating the centrifuge receptacle at a high speed for centrifugally extracting molten solder from the centrifuge receptacle, radially outwardly through the perforation holes into the solder collection container.