Invention Grant
- Patent Title: Array substrate, manufacturing method for the same and display device
- Patent Title (中): 阵列基板,制造方法及显示装置
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Application No.: US14108856Application Date: 2013-12-17
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Publication No.: US09229286B2Publication Date: 2016-01-05
- Inventor: Xiaming Zhu , Liang Sun , Jianfeng Yuan , Seung Moo Rim , Xibin Shao
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- Applicant Address: CN Beijing CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Beijing CN Beijing
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: CN201210552372 20121218
- Main IPC: G02F1/1333
- IPC: G02F1/1333 ; G02F1/1362 ; H01L27/12

Abstract:
According to one aspect of the present invention, the provided is an array substrate. Specifically, the first conductive strip that is coupled to the first data shorting bar and the second conductive strip that is coupled to the second data shorting bar are formed on the array substrate. The width of the first conductive strip is greater than the width of the first data shorting bar. The width of the second conductive strip is greater than the width of the second data shorting bar. The first conductive strip is overlapped with the second conductive strip. Such a structure of the array substrate effectively increases the overlapped capacitance between the data metal layer and the gate metal layer.
Public/Granted literature
- US20140168559A1 Array Substrate, Manufacturing Method for the Same and Display Device Public/Granted day:2014-06-19
Information query
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