An electrostatic dissipative, polypropylene-based resin expanded bead having an expanded core layer of a polypropylene-based resin, and a cover layer that covers the expanded core layer and that is composed of a mixed resin containing electrically conductive carbon black, wherein the mixed resin includes a polypropylene resin which forms a continuous phase and a polyethylene resin which forms dispersed phases dispersed in the continuous phase, with the electrically conductive carbon black being unevenly distributed to the dispersed phases side. In-mold molding of the expanded beads gave a molded article.