Invention Grant
US09230875B2 Interposer package structure for wireless communication element, thermal enhancement, and EMI shielding
有权
用于无线通信元件,热增强和EMI屏蔽的内插器封装结构
- Patent Title: Interposer package structure for wireless communication element, thermal enhancement, and EMI shielding
- Patent Title (中): 用于无线通信元件,热增强和EMI屏蔽的内插器封装结构
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Application No.: US14260872Application Date: 2014-04-24
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Publication No.: US09230875B2Publication Date: 2016-01-05
- Inventor: Sam Ziqun Zhao , Rezaur Rahman Khan
- Applicant: Broadcom Corporation
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H04B1/40
- IPC: H04B1/40 ; H01L23/34 ; H01L23/552 ; H01L23/36 ; H01L23/48 ; H01L23/498 ; H01L23/50 ; H01L23/31 ; H04B5/00 ; H04B7/06

Abstract:
Embodiments of provide an integrated circuit (IC) device. The IC device can include a substrate having first and second opposing surfaces, an IC die electrically coupled to the first surface of the substrate, a plurality of contact members coupled to the first surface of the substrate, and an interposer. The interposer can include a plurality of contact elements located on a first surface thereof, each conductive element being coupled to a respective one of the plurality of contact members, and an antenna formed using a conductive layer of the interposer, the antenna being electrically coupled to the IC die through at least one of the plurality of contact elements and at least one of the plurality of contact members.
Public/Granted literature
- US20140235183A1 INTERPOSER PACKAGE STRUCTURE FOR WIRELESS COMMUNICATION ELEMENT, THERMAL ENHANCEMENT, AND EMI SHIELDING Public/Granted day:2014-08-21
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