Invention Grant
- Patent Title: Ball grid array packaged camera device soldered to a substrate
- Patent Title (中): 焊接到基板的球栅阵列封装相机装置
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Application No.: US14036017Application Date: 2013-09-25
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Publication No.: US09231124B2Publication Date: 2016-01-05
- Inventor: Binghua Pan , Yew Kwang Low , Sim Ying Yong
- Applicant: DELPHI TECHNOLOGIES, INC.
- Applicant Address: US MI Troy
- Assignee: Delphi Technologies, Inc.
- Current Assignee: Delphi Technologies, Inc.
- Current Assignee Address: US MI Troy
- Agent Lawrence D. Hazelton
- Main IPC: H01L31/00
- IPC: H01L31/00 ; H01L31/02 ; H01L27/146
Abstract:
An assembly that attaches a ball grid array (BGA) packaged camera device to a printed circuit board (PCB) substrate is provided. The assembly includes a spacer between the device and the substrate. The spacer is configured to prevent excessive collapse of solder balls located between the device and the substrate during reflow of the solder balls. The spacer includes one of solder mask, tape, and/or legend ink.
Public/Granted literature
- US20150084150A1 BALL GRID ARRAY PACKAGED CAMERA DEVICE SOLDERED TO A SUBSTRATE Public/Granted day:2015-03-26
Information query
IPC分类:
