发明授权
- 专利标题： Light-emitting diode structure with electrode pads of similar surface roughness and method for manufacturing the same
- 专利标题（中）： 具有类似表面粗糙度的电极焊盘的发光二极管结构及其制造方法
-
申请号： US13221908申请日： 2011-08-31
-
公开(公告)号： US09231158B2公开(公告)日： 2016-01-05
- 发明人: Cheng-Ta Kuo , Kuo-Hui Yu , Chao-Hsing Chen , Tsun-Kai Ko , Chi-Ming Huang , Shih-Wei Yen , Chien-Kai Chung
- 申请人： Cheng-Ta Kuo , Kuo-Hui Yu , Chao-Hsing Chen , Tsun-Kai Ko , Chi-Ming Huang , Shih-Wei Yen , Chien-Kai Chung
- 申请人地址： TW Hsinchu
- 专利权人： Epistar Corporation
- 当前专利权人： Epistar Corporation
- 当前专利权人地址： TW Hsinchu
- 代理商 Ding Yu Tan
- 优先权： TW95150037A 20061229
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L33/38 ; H01L33/20
摘要：
A light-emitting diode (LED) structure and a method for manufacturing the LED structure are disclosed for promoting the recognition rate of LED chips, wherein a roughness degree of the surface under a first electrode pad of a first conductivity type is made similar to that of the surface under a second electrode pad of a second conductivity type, so that the luster shown from the first electrode pad can be similar to that from the second electrode pad, thus resolving the poor recognition problem of wire-bonding machines caused by different lusters from the first and second electrode pads.
公开/授权文献
信息查询
IPC分类:
