发明授权
- 专利标题: Integrated package insertion and loading mechanism (iPILM)
- 专利标题(中): 集成封装插入和加载机制(iPILM)
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申请号: US13995927申请日: 2012-03-30
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公开(公告)号: US09231318B2公开(公告)日: 2016-01-05
- 发明人: Tao Liu , Tejinder Pal S. Aulakh
- 申请人: Tao Liu , Tejinder Pal S. Aulakh
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Blakely, Sokoloff, Taylor & Zafman LLP
- 国际申请: PCT/US2012/031669 WO 20120330
- 国际公布: WO2013/147884 WO 20131003
- 主分类号: H01R13/62
- IPC分类号: H01R13/62 ; H01R4/50 ; H01L23/32 ; H05K7/10 ; H01R43/20
摘要:
A holding member and system including a first holding member and a second holding member, wherein each of the first holding member and the second holding member are coupled to opposite sides of a load plate of a socket. A holding member includes a body including a pair of arms extending from a first side of the body and spaced to accommodate a portion of an integrated circuit chip package therebetween and at least one clip extending from a second side opposite the first side. Also, a method including coupling an integrated circuit chip package to a first holding member and a second holding member, wherein the first holding member is coupled to a first side of a load plate of a socket and the second holding member is coupled to a second side of the load plate; and inserting the package into a socket of a printed circuit board.
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