Invention Grant
- Patent Title: Hot water supply apparatus associated with heat pump
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Application No.: US14334925Application Date: 2014-07-18
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Publication No.: US09234676B2Publication Date: 2016-01-12
- Inventor: Byungsoon Kim , Jahyung Koo , Kyongmin Kwon
- Applicant: LG ELECTRONICS INC.
- Applicant Address: KR Seoul
- Assignee: LG Electronics Inc.
- Current Assignee: LG Electronics Inc.
- Current Assignee Address: KR Seoul
- Agency: Ked & Associates LLP
- Priority: KR10-2010-0050322 20100528
- Main IPC: F25B7/00
- IPC: F25B7/00 ; F24H9/00 ; F24D11/02 ; F24D17/02 ; F24D19/10 ; F25B13/00 ; F25B25/00 ; F25B30/02

Abstract:
A hot water supply apparatus associated with a heat pump is provided. The hot water supply apparatus may employ a cascade heat pump including a two-stage cycle to perform a hot water supply operation. Refrigerants flowing through a heat side heat exchanger and a usage side heat exchanger may be heat-exchanged with water. Thus, the hot water supply operation may be continuously performed, without a defrosting operation, and hot water supply performance and heating performance may be improved.
Public/Granted literature
- US20140326013A1 HOT WATER SUPPLY APPARATUS ASSOCIATED WITH HEAT PUMP Public/Granted day:2014-11-06
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