Invention Grant
- Patent Title: High bandwidth jack with RJ45 backwards compatibility
- Patent Title (中): 高带宽插孔，RJ45向后兼容
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Application No.: US14294963Application Date: 2014-06-03
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Publication No.: US09236683B2Publication Date: 2016-01-12
- Inventor: Robert E. Fransen , Michael K. Yuan , Satish I. Patel
- Applicant: Panduit Corp.
- Applicant Address: US IL Tinley Park
- Assignee: Panduit Corp.
- Current Assignee: Panduit Corp.
- Current Assignee Address: US IL Tinley Park
- Agent Christopher S. Clancy; Yuri Astvatsaturov
- Main IPC: H01R13/658
- IPC: H01R13/658 ; H01R9/03 ; H01R13/627 ; H01R13/648 ; H01R4/24 ; H01R12/73 ; H01R13/506 ; H01R13/6461 ; H01R13/6585 ; H01R13/66 ; H01R24/64 ; H01R27/00 ; H01R29/00
Abstract:
The present invention generally relates to network connectors, and more particularly, to apparatuses, systems, and methods associated with network jacks having compatibility with more than one plug and corresponding plugs. In one embodiment, the present invention is a jack having multiple printed circuit boards, wherein each circuit board is used for connection to a particular style of a plug. In one embodiment, the jack according to the present invention is compatible with an RJ45 plug.
Public/Granted literature
- US20140287609A1 High Bandwidth Jack wtih RJ45 Backwards Compatibility Public/Granted day:2014-09-25
Information query
