Invention Grant
- Patent Title: Thermal architecture
- Patent Title (中): 热结构
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Application No.: US13629557Application Date: 2012-09-27
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Publication No.: US09239598B2Publication Date: 2016-01-19
- Inventor: Brett W. Degner , Douglas L. Heirich , Frank F. Liang , Jay Nigen
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Downey Brand LLP
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K5/00 ; H05K7/20 ; F28D7/02 ; F16L3/22 ; G06F1/18 ; F28F13/00 ; F28D15/00 ; F28F7/00 ; F28D21/00 ; F28D1/02

Abstract:
The described embodiment relates generally to the field of thermal management. More specifically an apparatus for cooling a unibody computing device with obscured inlet and outlet vents is disclosed. Inlet vents are arranged on a bottom surface of the unibody computing device and then exhaust air is vented out from a rear surface of the computing device. The rear vents can be obscured by a stand designed to support the weight of the computing device. By venting exhaust air to either side of the support stand exhaust air can be prevented from being drawn back into the inlet vents, thereby avoiding an overheating condition.
Public/Granted literature
- US20130319638A1 THERMAL ARCHITECTURE Public/Granted day:2013-12-05
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