Invention Grant
US09240353B2 Method for manufacturing array substrate by forming common electrode connecting NMOS in display area and PMOS in drive area
有权
通过在显示区域中形成连接NMOS的公共电极和驱动区域中的PMOS来制造阵列基板的方法
- Patent Title: Method for manufacturing array substrate by forming common electrode connecting NMOS in display area and PMOS in drive area
- Patent Title (中): 通过在显示区域中形成连接NMOS的公共电极和驱动区域中的PMOS来制造阵列基板的方法
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Application No.: US14366925Application Date: 2013-12-09
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Publication No.: US09240353B2Publication Date: 2016-01-19
- Inventor: Yuqing Yang , Seung Yik Park , Byung Chun Lee
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Beijing CN Chengdu, Sichuan
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Beijing CN Chengdu, Sichuan
- Agency: Ladas & Parry LLP
- Priority: CN201310430750 20130918
- International Application: PCT/CN2013/088837 WO 20131209
- International Announcement: WO2015/039388 WO 20150326
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L21/77 ; H01L27/12 ; H01L21/84

Abstract:
A method for manufacturing an array substrate includes: forming a shielding layer, an insulating buffer layer, active layers, a gate insulating layer and NMOS gate electrodes in a display area and a drive area on a substrate in sequence; forming a PMOS gate electrode in the drive area on the foregoing substrate, in which the NMOS gate electrodes and the PMOS gate electrode are provided on the same layer; meanwhile forming a first through hole in a common electrode connecting area, in which the first through hole is configured to connect the shielding layer and a source/drain electrode layer; forming an intermediate insulating layer on the foregoing substrate, forming a second through hole in the common electrode connecting area and third through holes in the display area and the drive area, in which the second through hole is formed at a same position as the first through hole and configured to connect the shielding layer and a source/drain electrode layer, and the third through holes are configured to connect the active layers and the source/drain electrode layer; and forming the source/drain electrode layer on the foregoing substrate.
Public/Granted literature
- US20150214120A1 METHOD FOR MANUFACTURING ARRAY SUBSTRATE Public/Granted day:2015-07-30
Information query
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