Invention Grant
- Patent Title: Semiconductor packages having wire bond wall to reduce coupling
- Patent Title (中): 具有导线接合壁的半导体封装以减少耦合
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Application No.: US14261387Application Date: 2014-04-24
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Publication No.: US09240390B2Publication Date: 2016-01-19
- Inventor: Shun Meen Kuo , Paul R. Hart , Margaret A. Szymanowski
- Applicant: FREESCALE SEMICONDUCTOR, INC.
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agent Sherry W. Schumm
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/00 ; H03F1/02 ; H01L23/66

Abstract:
A device (e.g., a Doherty amplifier) housed in an air cavity package includes one or more isolation structures over a surface of a substrate and defining an active circuit area. The device also includes first and second adjacent circuits within the active circuit area, first and second leads coupled to the isolation structure(s) between opposite sides of the package and electrically coupled to the first circuit, third and fourth leads coupled to the isolation structure(s) between the opposite sides of the package and electrically coupled to the second circuit, a first terminal over the first side of the package between the first lead and the third lead, a second terminal over the second side of the package between the second lead and the fourth lead, and an electronic component coupled to the package and electrically coupled to the first terminal, the second terminal, or both the first and second terminals.
Public/Granted literature
- US20150002229A1 SEMICONDUCTOR PACKAGES HAVING WIRE BOND WALL TO REDUCE COUPLING Public/Granted day:2015-01-01
Information query
IPC分类: