Invention Grant
US09240398B2 Method for producing image pickup apparatus and method for producing semiconductor apparatus
有权
用于制造图像拾取装置的方法和用于制造半导体装置的方法
- Patent Title: Method for producing image pickup apparatus and method for producing semiconductor apparatus
- Patent Title (中): 用于制造图像拾取装置的方法和用于制造半导体装置的方法
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Application No.: US14557157Application Date: 2014-12-01
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Publication No.: US09240398B2Publication Date: 2016-01-19
- Inventor: Noriyuki Fujimori , Takatoshi Igarashi , Kazuhiro Yoshida
- Applicant: OLYMPUS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: OLYMPUS CORPORATION
- Current Assignee: OLYMPUS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Priority: JP2012-123226 20120530
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50 ; H01L25/00 ; H01L27/146 ; H01L21/78 ; H01L21/66 ; H01L21/786 ; H01L23/31
Abstract:
A method for producing an image pickup apparatus includes processes of: cutting an image pickup chip substrate to fabricate a plurality of image pickup chips; bonding the image pickup chips to a glass wafer via a transparent adhesive layer as well as bonding dummy chips to an outer peripheral region of the glass wafer where the image pickup chips are not bonded to fabricate a joined wafer; filling a sealing member between the image pickup chips and the dummy chips; machining the joined wafer to thin a thickness; and cutting the joined wafer.
Public/Granted literature
- US20150087088A1 METHOD FOR PRODUCING IMAGE PICKUP APPARATUS AND METHOD FOR PRODUCING SEMICONDUCTOR APPARATUS Public/Granted day:2015-03-26
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