发明授权
- 专利标题： Wired circuit board and producing method thereof
- 专利标题（中）： 有线电路板及其制造方法
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申请号： US13485274申请日： 2012-05-31
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公开(公告)号： US09241410B2公开(公告)日： 2016-01-19
- 发明人: Saori Ishigaki , Jun Ishii , Yoshito Fujimura , Yuu Sugimoto
- 申请人： Saori Ishigaki , Jun Ishii , Yoshito Fujimura , Yuu Sugimoto
- 申请人地址： JP Osaka
- 专利权人： NITTO DENKO CORPORATION
- 当前专利权人： NITTO DENKO CORPORATION
- 当前专利权人地址： JP Osaka
- 代理机构： Edwards Neils PLLC
- 代理商 Jean C. Edwards, Esq.
- 优先权： JP2011-121280 20110531; JP2012-067717 20120323
- 主分类号： H05K1/16
- IPC分类号： H05K1/16 ; H05K1/18 ; H05K3/32 ; G11B5/48
摘要：
A wired circuit board includes an insulating layer, and a conductive layer including a wire covered with the insulating layer and a terminal continued to the wire to electrically connect the wire to an electronic element. The insulating layer is formed with an insulating opening exposing the terminal, and the terminal is formed in a pattern which is indented in a thickness direction.
公开/授权文献
- US20130014976A1 WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF 公开/授权日：2013-01-17
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