发明授权
- 专利标题: Fluid-cooled heat dissipation device
- 专利标题(中): 流体冷却散热装置
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申请号: US13860937申请日: 2013-04-11
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公开(公告)号: US09241423B2公开(公告)日: 2016-01-19
- 发明人: Chia-Pin Chiu
- 申请人: INTEL CORPORATION
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Winkle, PLLC
- 主分类号: H05K7/20
- IPC分类号: H05K7/20 ; H05K1/00 ; H01R13/46 ; H05K3/30 ; F28F9/00 ; F28F3/12 ; H01L23/473 ; F04B17/00
摘要:
A heat dissipation device that includes a base plate having a plurality of substantially circular channels which are substantially concentrically arranged; and a fluid distribution structure adjacent the base plate, wherein the fluid distribution structure has a plurality of inlet conduits extending substantially radially from a central area with each of the plurality of inlet conduits having at least one fluid delivery port extending through the fluid distribution structure to at least one base plate circular channel, and wherein the fluid distribution structure has a plurality of outlet zones defined between adjacent inlet conduits with each of the plurality of outlet zones having at least one fluid removal port extending through the fluid distribution structure to at least one base plate circular channel.
公开/授权文献
- US20140307388A1 FLUID-COOLED HEAT DISSIPATION DEVICE 公开/授权日:2014-10-16
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