发明授权
- 专利标题： Apparatus of manufacturing semiconductor packages and methods of manufacturing semiconductor packages using the same
- 专利标题（中）： 制造半导体封装的装置和使用其制造半导体封装的方法
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申请号： US13495837申请日： 2012-06-13
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公开(公告)号： US09245787B2公开(公告)日： 2016-01-26
- 发明人: Chang-Seong Jeon , Sangwook Park , TeakHoon Lee , Ilyoung Han
- 申请人： Chang-Seong Jeon , Sangwook Park , TeakHoon Lee , Ilyoung Han
- 申请人地址： KR Suwon-Si, Gyeonggi-Do
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Suwon-Si, Gyeonggi-Do
- 代理机构： F. Chau & Associates, LLC
- 优先权： KR10-2011-0056991 20110613
- 主分类号： B25B11/00
- IPC分类号： B25B11/00 ; H01L21/683 ; H01L23/00 ; H01L25/065
摘要：
Apparatuses of manufacturing semiconductor packages are provided. An apparatus includes a chuck having a body, a porous plate disposed on the body, and a buffer pad disposed on the plate to provide a place on which a plurality of chips are loaded. The buffer pad has elasticity greater than the plate. The apparatus also includes a vacuum part supplying vacuum to the chuck so that the plurality of chips are sucked onto the buffer pad. Methods of manufacturing semiconductor packages using the apparatus are also provided.
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