Invention Grant
- Patent Title: Apparatus of manufacturing semiconductor packages and methods of manufacturing semiconductor packages using the same
- Patent Title (中): 制造半导体封装的装置和使用其制造半导体封装的方法
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Application No.: US13495837Application Date: 2012-06-13
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Publication No.: US09245787B2Publication Date: 2016-01-26
- Inventor: Chang-Seong Jeon , Sangwook Park , TeakHoon Lee , Ilyoung Han
- Applicant: Chang-Seong Jeon , Sangwook Park , TeakHoon Lee , Ilyoung Han
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2011-0056991 20110613
- Main IPC: B25B11/00
- IPC: B25B11/00 ; H01L21/683 ; H01L23/00 ; H01L25/065
Abstract:
Apparatuses of manufacturing semiconductor packages are provided. An apparatus includes a chuck having a body, a porous plate disposed on the body, and a buffer pad disposed on the plate to provide a place on which a plurality of chips are loaded. The buffer pad has elasticity greater than the plate. The apparatus also includes a vacuum part supplying vacuum to the chuck so that the plurality of chips are sucked onto the buffer pad. Methods of manufacturing semiconductor packages using the apparatus are also provided.
Public/Granted literature
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