发明授权
- 专利标题: Liquid DIMM cooling device
- 专利标题(中): 液体DIMM散热装置
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申请号: US13583021申请日: 2011-02-04
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公开(公告)号: US09245820B2公开(公告)日: 2016-01-26
- 发明人: Gottfried Goldrian , Manfred Ries
- 申请人: Gottfried Goldrian , Erika Goldrian , Manfred Ries
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理商 Jeffrey L. Streets
- 优先权: EP10155739 20100308
- 国际申请: PCT/EP2011/051646 WO 20110204
- 国际公布: WO2011/110390 WO 20110915
- 主分类号: G06F1/20
- IPC分类号: G06F1/20 ; H05K7/20 ; H01L23/473 ; H01L23/467
摘要:
A liquid cooling device comprises a heat spreader disposed along a plurality of memory modules on a dual in-line memory module (DIMM), a cold rail block extending along the heat spreader and a compressible thermal adapter interleaved between the cold rail block and the memory modules. The thermal adapter is compressible in a direction perpendicular to the plane of the DIMM board, thus allowing the components of the cooling device to be moved and adjusted relative to each other in a direction perpendicular to the plane of the DIMM. In a preferred embodiment, matching smooth surfaces of adjacent components within the cooling device are collated with a lubricant, thus permitting a low-friction gliding of these components relative to each other and allowing the DIMM to be easily removed from the cooling device and to be replaced without effort and without tooling.
公开/授权文献
- US20130027870A1 LIQUID DIMM COOLING DEVICE 公开/授权日:2013-01-31