发明授权
- 专利标题： Metal pads with openings in integrated circuits
- 专利标题（中）： 集成电路中具有开口的金属焊盘
-
申请号： US13764569申请日： 2013-02-11
-
公开(公告)号： US09245833B2公开(公告)日： 2016-01-26
- 发明人: Shuo-Mao Chen , Yu-Ting Huang
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/498 ; H01L23/31 ; H01L23/00 ; H01L23/525
摘要：
A device includes a metal pad, and a passivation layer including portions overlapping edge portions of the metal pad. A Post-Passivation-Interconnect (PPI) includes a trace portion overlying the passivation layer, and a pad portion connected to the trace portion. A polymer layer includes an upper portion over the PPI, and a plug portion extending into, and encircled by, the pad portion of the PPI.
公开/授权文献
- US20140061898A1 Metal Pads with Openings in Integrated Circuits 公开/授权日：2014-03-06
信息查询
IPC分类:
