Invention Grant
US09245870B1 Systems and methods for providing data channels at a die-to-die interface
有权
用于在管芯到管芯接口提供数据通道的系统和方法
- Patent Title: Systems and methods for providing data channels at a die-to-die interface
- Patent Title (中): 用于在管芯到管芯接口提供数据通道的系统和方法
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Application No.: US14516763Application Date: 2014-10-17
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Publication No.: US09245870B1Publication Date: 2016-01-26
- Inventor: LuVerne Ray Peterson , Thomas Clark Bryan , Alvin Leng Sun Loke , Tin Tin Wee , Gregory Francis Lynch , Stephen Robert Knol
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Haynes and Boone LLP
- Main IPC: H01L25/00
- IPC: H01L25/00 ; H01L25/065
Abstract:
A circuit includes a first die having a first array of exposed data nodes, and a second die having a second array of exposed data nodes, wherein a given data node of the first array corresponds to a respective data node on the second array, further wherein the first array and the second array share a spatial arrangement of the data nodes, wherein the first die has data inputs and sequential logic circuits for each of the data nodes of the first array on a first side of the first array, and wherein the second die has data outputs and sequential logic circuits for each of the data nodes of the second array on a second side of the second array, the first and second sides being different.
Information query
IPC分类:
