Invention Grant
- Patent Title: Carrier for flexible substrate, substrate processing apparatus including the carrier, and method of manufacturing flexible display apparatus
- Patent Title (中): 柔性基板的载体,包括载体的基板处理装置以及柔性显示装置的制造方法
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Application No.: US14089537Application Date: 2013-11-25
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Publication No.: US09246124B2Publication Date: 2016-01-26
- Inventor: Hayk Khachatryan
- Applicant: SAMSUNG DISPLAY CO., LTD.
- Applicant Address: KR Yongin-si
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR Yongin-si
- Agency: Christie, Parker & Hale, LLP
- Priority: KR10-2013-0070494 20130619
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L51/52 ; G02F1/1333 ; H01L51/00

Abstract:
Provided is a carrier for a flexible substrate which is capable of handling a flexible substrate during a flexible substrate processing process, while allowing the flexible substrate to be easily separated. Also provided is a substrate processing apparatus, including the carrier, and a method of manufacturing a flexible display apparatus. The carrier includes a substrate supporting portion having a top surface including a mounting surface, an outer circumferential surface, surrounding the mounting surface, and a first heat cutting portion. The first heat cutting portion is located outside the mounting surface so as to be exposed on the top surface and generates heat when a current flows through the first heat cutting portion.
Public/Granted literature
Information query
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