Invention Grant
US09246134B2 Lamination transfer films for forming articles with engineered voids
有权
用于成型具有工程化空隙的复合转移膜
- Patent Title: Lamination transfer films for forming articles with engineered voids
- Patent Title (中): 用于成型具有工程化空隙的复合转移膜
-
Application No.: US14159300Application Date: 2014-01-20
-
Publication No.: US09246134B2Publication Date: 2016-01-26
- Inventor: Evan L. Schwartz , Justin P. Meyer , Olester Benson, Jr. , Terry O. Collier , Michael Benton Free , Robert F. Kamrath , Mieczyslaw H. Mazurek , David B. Olson , K. Raveesh Shenoy , Martin B. Wolk
- Applicant: 3M Innovative Properties Company
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Agent Jeffrey S. Kollodge
- Main IPC: H01L51/52
- IPC: H01L51/52 ; B32B3/26 ; B32B27/30 ; B32B37/18 ; B32B38/00 ; B32B38/06 ; G03F7/09 ; B32B38/18 ; B32B37/12
Abstract:
Transfer films, articles made therewith, and methods of making and using transfer films to form bridged nanostructures are disclosed.
Public/Granted literature
- US20150207107A1 LAMINATION TRANSFER FILMS FOR FORMING ARTICLES WITH ENGINEERED VOIDS Public/Granted day:2015-07-23
Information query
IPC分类:
