Invention Grant
- Patent Title: Array substrate and manufacturing method thereof
- Patent Title (中): 阵列基板及其制造方法
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Application No.: US14103617Application Date: 2013-12-11
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Publication No.: US09246136B2Publication Date: 2016-01-26
- Inventor: Young Suk Song , Seong Yeol Yoo , Seung Jin Choi , Hee Cheol Kim
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Ladas & Parry LLP
- Priority: CN201210537767 20121212
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L51/56 ; H01L51/52 ; H01L27/32

Abstract:
Embodiments of the present invention disclose a method for manufacturing an array substrate comprising: forming patterns of a thin film transistor structure and a passivation layer on a base substrate to define a plurality of pixel units on the base substrate; forming subsequently patterns of a transflective layer and a color filter in a pixel region of the pixel unit, the color filter being disposed above the transflective layer; forming an organic light-emitting diode in the pixel region of the pixel unit so that the transflective layer and the color filter are disposed between the organic light-emitting diode and the thin film transistor structure. Embodiments of the present invention also provide an array substrate.
Public/Granted literature
- US20140159020A1 ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-06-12
Information query
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