Invention Grant
- Patent Title: Pulse shaping device and pulse shaping method
- Patent Title (中): 脉冲整形装置和脉冲整形方法
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Application No.: US14101523Application Date: 2013-12-10
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Publication No.: US09246304B2Publication Date: 2016-01-26
- Inventor: Kenji Tanaka , Michio Oka
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Hazuki International, LLC
- Priority: JP2012-280736 20121225
- Main IPC: H01S3/10
- IPC: H01S3/10 ; H01S5/00 ; H01S5/14 ; H01S5/065 ; H01S5/40 ; H01S5/50

Abstract:
There is provided a pulse shaping device including a pulse generator configured to generate pulsed light by using a semiconductor laser for emitting light of a predetermined wavelength, and an optical member provided in a subsequent stage of the pulse generator and configured to compress a pulse time width of the pulsed light. The pulsed light has a first frequency dispersion state. The optical member imparts a second frequency dispersion state to the pulsed light, the second frequency dispersion state being a frequency dispersion state opposite to the first frequency dispersion state.
Public/Granted literature
- US20140177661A1 PULSE SHAPING DEVICE AND PULSE SHAPING METHOD Public/Granted day:2014-06-26
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