Invention Grant
- Patent Title: Strain relief structures for stretchable interconnects
- Patent Title (中): 用于伸缩互连的应变消除结构
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Application No.: US13843880Application Date: 2013-03-15
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Publication No.: US09247637B2Publication Date: 2016-01-26
- Inventor: Yung-Yu Hsu
- Applicant: MC10, Inc.
- Applicant Address: US MA Lexington
- Assignee: MC10, Inc.
- Current Assignee: MC10, Inc.
- Current Assignee Address: US MA Lexington
- Agency: Nixon Peabody LLP
- Main IPC: H05K1/02
- IPC: H05K1/02

Abstract:
Intersection structures are provided to reduce a strain in a conformable electronic system that includes multi-level arrangements of stretchable interconnect structures. Bypass regions are formed in areas of the stretchable interconnect structures that may ordinarily cross or pass each other. The bypass regions of the stretchable interconnects are disposed relative to each other such that the intersection structure encompasses at least a portion of the bypass regions of each stretchable interconnect structure. The intersection structure has elastic properties that relieve a mechanical strain on the bypass regions during stretching at least one of the stretchable interconnect structures.
Public/Granted literature
- US20140022746A1 STRAIN RELIEF STRUCTURES FOR STRETACHBLE INTERCONNECTS Public/Granted day:2014-01-23
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