发明授权
- 专利标题: Wafer mixing device
- 专利标题(中): 晶圆搅拌装置
-
申请号: US14230468申请日: 2014-03-31
-
公开(公告)号: US09248418B1公开(公告)日: 2016-02-02
- 发明人: Robert Smith , Nolan Smith , Seungsuk Lee
- 申请人: Komax Systems, Inc.
- 代理机构: Bay Area Technology Law Group PC
- 主分类号: B01F5/06
- IPC分类号: B01F5/06
摘要:
A stationary material mixing apparatus located within a cylindrically-shaped conduit. The material mixing apparatus includes a front face, rear face, cone-shaped module having a base and apex supported on said front face and extending toward an upstream end of the conduit. A channel for introducing an additive to the fluid stream is provided, the additive being introduced at the apex of the cone-shaped module, the material mixing apparatus further being provided with three circular openings positioned 120 degrees from each other and each having a baffle configured therein.
信息查询