Invention Grant
US09249014B2 Packaged nano-structured component and method of making a packaged nano-structured component
有权
包装的纳米结构组分和制备包装的纳米结构组分的方法
- Patent Title: Packaged nano-structured component and method of making a packaged nano-structured component
- Patent Title (中): 包装的纳米结构组分和制备包装的纳米结构组分的方法
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Application No.: US13670390Application Date: 2012-11-06
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Publication No.: US09249014B2Publication Date: 2016-02-02
- Inventor: Khalil Hosseini , Joachim Mahler , Georg Meyer-Berg
- Applicant: Infineon Technologies AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H05K1/00
- IPC: H05K1/00 ; B81C3/00 ; C09J7/00 ; H01L21/306 ; H01L21/58 ; H01L29/30 ; H01L23/31 ; H01L21/302 ; H01L23/495 ; H01L29/06 ; H01L21/268 ; H01L23/00 ; H01L23/14 ; B82Y30/00
Abstract:
An assembled component and a method for assembling a component are disclosed. In one embodiment the assembled component includes a component carrier, an attachment layer disposed on the component carrier and a component disposed on the attachment layer, the component having a nano-structured first main surface facing the component carrier.
Public/Granted literature
- US20140126165A1 Packaged Nano-Structured Component and Method of Making a Packaged Nano-Structured Component Public/Granted day:2014-05-08
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