Invention Grant
- Patent Title: Determining intra-die variation of an integrated circuit
- Patent Title (中): 确定集成电路的管芯内部变化
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Application No.: US13967491Application Date: 2013-08-15
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Publication No.: US09255962B2Publication Date: 2016-02-09
- Inventor: Jeanne P. S. Bickford , Aurelius L. Graninger , Christopher T. McEvoy , Joseph J. Oler, Jr.
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GlobalFoundries, Inc.
- Current Assignee: GlobalFoundries, Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Hoffman Warnick LLC
- Agent Anthony J. Canale
- Main IPC: G01R31/28
- IPC: G01R31/28

Abstract:
Embodiments of the present invention disclose an apparatus and method to determine the intra-chip variation of an integrated circuit. In an embodiment, an apparatus comprises a test macro that includes two or more test structures; wherein each test structure includes identical copies of the same performance monitor; wherein each performance monitor has a unique bounding circuitry that encompasses the performance monitor; and wherein the two or more test structures are positioned close enough to each other as to reduce systematic across chip variation between the two or more test structures.
Public/Granted literature
- US20150048860A1 DETERMINING INTRA-DIE VARIATION OF AN INTEGRATED CIRCUIT Public/Granted day:2015-02-19
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