Invention Grant
US09255962B2 Determining intra-die variation of an integrated circuit 有权
确定集成电路的管芯内部变化

Determining intra-die variation of an integrated circuit
Abstract:
Embodiments of the present invention disclose an apparatus and method to determine the intra-chip variation of an integrated circuit. In an embodiment, an apparatus comprises a test macro that includes two or more test structures; wherein each test structure includes identical copies of the same performance monitor; wherein each performance monitor has a unique bounding circuitry that encompasses the performance monitor; and wherein the two or more test structures are positioned close enough to each other as to reduce systematic across chip variation between the two or more test structures.
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