Invention Grant
- Patent Title: Dielectric insulation medium
- Patent Title (中): 绝缘介质
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Application No.: US13769018Application Date: 2013-02-15
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Publication No.: US09257213B2Publication Date: 2016-02-09
- Inventor: Mathias Ingold , Thomas Alfred Paul , Javier Mantilla , Oliver Cossalter , Judith Kessler , Navid Mahdizadeh
- Applicant: Mathias Ingold , Thomas Alfred Paul , Javier Mantilla , Oliver Cossalter , Judith Kessler , Navid Mahdizadeh
- Applicant Address: CH
- Assignee: ABB TECHNOLOGY AG
- Current Assignee: ABB TECHNOLOGY AG
- Current Assignee Address: CH
- Agency: St. Onge Steward Johnston & Reens LLC
- Main IPC: H01B3/56
- IPC: H01B3/56 ; H01F27/02 ; H01H33/64 ; H02B7/00 ; H02B7/01 ; H05K5/02
Abstract:
A dielectric insulation medium including sulphur hexafluoride (SF6) and/or tetrafluoro methane (CF4), in a mixture with at least one further component being an at least partially fluorinated fluoroketone.
Public/Granted literature
- US20130221292A1 Dielectric Insulation Medium Public/Granted day:2013-08-29
Information query
